Liquid Cooling for Data Centers

Cutting edge AI and HPC clusters require not only the highest performing versions of the latest CPU and GPU offerings from Intel, AMD and NVIDIA, but all packaged in dense configurations. This translates into substantially higher wattage densities at both the node and the rack level. Data centers around the globe are finding that liquid cooling is becoming a necessity as air is no longer a reliable solution. Asetek's data center technologies bring advances in performance and increased densities.

Energy saving technology for data centers and the planet

Benefits of liquid cooling over air cooling in data centers

Liquid cooling enables extreme high performance computing (HPC) with dramatic energy savings.

  • Reduces data center energy usage for cooling by up to 50% over traditional air-cooling
  • Lowers processor temps, resulting in 4% reduction in solution times
  • Minimizes latency by maximizing cluster interconnect density​

Enabling High Performance, High Wattage Densities

Asetek liquid coolers are a drop-in replacement for air heat sinks within server nodes. Designed to fit within a 1U chassis, this allows for maximum densities at both the node-level and rack-level to minimize the interconnect distance between the servers both in and between the racks.

Our solutions are based on low pressure, redundant pumps and sealed liquid path cooling within each server node. 

Asetek datacenter liquid cooling in server

Flexible, Proven and Reliable Liquid Cooling Technology

Our Direct-to-Chip (D2C) liquid cooling provides a distributed pumping architecture to address the full range of heat rejection scenarios in liquid-cooled data centers. We offer a highly flexible, reliable and proven liquid cooling platform to efficiently cool the latest server designs.

Flexible Platform for Liquid-Cooled Data Centers


Rack level Direct-to-Chip (D2C) solution for liquid cooled data centers.


Asetek InRackCDU Liquid Cooled Data Center Platform

D2C Ingredient Coolers

Direct to Chip (D2C) liquid cooling technology dramatically increases data center density and enables maximum sustained CPU throughput. 

D2C liquid cooling provides a distributed cooling architecture to address the full range of heat rejection scenarios in air-cooled and liquid-cooled data centers.


D2C Ingredient Coolers
Intel Buchanan Pass cooler with Asetek liquid cooling

Proven Performance

Our Direct-to-Chip (D2C) technology is cooling some of the fastest supercomputers in the world – including high profile GPU-enabled AI and HPC installations.

Solutions for a Variety of Data Centers

Density and interconnect optimization is key to obtaining the computational power needed for AI and HPC. With applications emerging to solve a range of challenges, these systems can have a diverse set of requirements when considering thermal solutions.