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Mobility and Sleek Design Without Sacrifice


Slim Form Factor Liquid Cooling Technology

The fundamental challenge of delivering Notebook and All-In-One (AIO) PCs that rival desktop workstation and high-end gaming PC performance is the lack of heat transfer area in these form factors for removing the heat generated by high performance CPUs and GPUs. The traditional methodology for cooling these components in laptops and AIOs is to use an individual heat pipe-based heat sink to cool each component independently. Each individual heat sink must be capable of cooling its component when that component is fully stressed. However, the reality is that GPUs and CPUs are rarely stressed simultaneously during real world operation. The result is under utilization of the limited available volume for cooling in these form factors.

Slim form factor liquid cooling technology takes full advantage of the fact that CPUs and GPUs are rarely fully stressed at the same time. The technology interconnects all of the thermal management devices enabling them to dynamically “borrow” idle cooling capacity from one another. In addition, the liquid cooled coldplate has less thermal resistance than a heat pipe. The result is slim form factor liquid cooling technology that can cool much more powerful hardware than is possible with heat pipe based heat sinks.

Key Attributes

  • Idle cooling capacity is eliminated by interconnecting all CPU and GPU cooling devices
  • Greater thermal mass of liquid eliminates heat spikes as loads transition between devices
  • Liquid cooled cold plate has less thermal resistance than heat pipes.


  • Higher performance (max TDP) parts and overclocked parts may be used in notebooks.
  • Higher performance, less expensive desktop components may be used in All-in-one PCs
  • Noise reduction is accomplished by spreading air flow across multiple heat exchangers and slowing fans.
Loop Tall